Semiconductor device having trench isolation structure and metho

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257520, 257640, H01L 2976

Patent

active

055980198

ABSTRACT:
A trench for element isolation is formed on the main surface of a semiconductor substrate. A conductive layer is formed in the trench, electrically connected to the semiconductor substrate. Oxide films and a dielectric film is formed between the conductive layer and the sidewall of the trench. A field oxide film is formed on the conductive layer. The dielectric film extends from the sidewall of the field oxide film to a region between the sidewall of the trench and the conductive layer. Consequently, a semiconductor device having an element isolation structure of superior isolation capability and high reliability can be obtained.

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Tsang, Y., Aitken, J.: Junction Breakdown Instabilities in Deep Trench Isolation Structures, US period.: IEEE Transactions on Electron Devices, vol. 38, No. 9, Sep. 1991, pp. 2134 to 2138.
Fazan, P., Mathews, V.: A Highly Manufacturable Trench Isolation Process for Deep Submicron DARMs,: IEDM 1993, pp. 57-60.
C. G. Jambotkar, "Improved Polysilicon -Filled Trench Isolation" U. S. Mag.: IBM Technical Disclosure Bulletin, vol. 27, No. 3, Aug. 1984, pp. 1481 to 1482.
B. El-Kareh et al., "Field-Shielded Trench Fill", U.S. Mag.: IBM Technical Disclosure Bulletin, vol. 27, No. 8, Jan. 1985, pp. 4851-4854.
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