Method and apparatus for conditioning a polishing pad in a chemi

Details Method and apparatus for conditioning a polishing pad in a chemi Method and apparatus for conditioning a polishing pad in a chemi

1997-03-10

2000-02-01

Morgan, Eileen P.

Abrading

Abrading process

With tool treating or forming

451 41, 451286, 451288, 451443, B24B 700

Patent

active

06019670&

ABSTRACT:
A chemical mechanical polishing apparatus including a carrier head having an integral conditioning member is described. The conditioning member includes a conditioning surface that may selectively be moved into contact with a polishing surface of a polishing pad. The conditioning member may be connected to a surface of the carrier's retaining ring assembly. As a result, the polishing surface may be conditioned either continuously or intermittently when a substrate is loaded in the carrier for polishing.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5433650 (1995-07-01), Winebarger
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5569062 (1996-10-01), Karlsrud
patent: 5681212 (1997-10-01), Hayakawa et al.

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