Hermetic package and packaged semiconductor chip having closely

Details Hermetic package and packaged semiconductor chip having closely Hermetic package and packaged semiconductor chip having closely

1989-07-03

1992-11-24

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

174 524, 257704, 257693, 257690, 257698, 257700, H01L 2304, H01L 2310

Patent

active

051667738

ABSTRACT:
A hermetic semiconductor package includes a ceramic lid with the device leads extending vertically through the lid. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and a substantial lead density.

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