Method and apparatus to heat the surface of a semiconductor die

Details Method and apparatus to heat the surface of a semiconductor die Method and apparatus to heat the surface of a semiconductor die

1991-05-31

1992-11-24

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158R, 324 731, 165 804, 16510433, G01R 3500, G01R 3102

Patent

active

051666073

ABSTRACT:
A method and apparatus are disclosed for burning-in semiconductor devices. The method includes the steps of: (1) heating the surface of the semiconductor device; (2) cooling the leads of the semiconductor device package so as to maintain the temperature of the outer portions of the leads at, near, or below room temperature; and optionally (3) causing circuits on the semiconductor device to operate electrically while it is being heated. An apparatus for implementing the aforementioned method is also disclosed. In a first embodiment, the apparatus comprises a base plate for heating the surface of the semiconductor device, a cooling plate for cooling the leads of the semiconductor device package, and optionally an electrical testing device for causing the semiconductor device to operate electrically during the heating process. In a second embodiment, the apparatus comprises the same elements as the first embodiment except that the cooling plate is replaced by a heat sink having a plurality of heat dissipating fins. The present method and apparatus eliminates the need for the bulky and expensive ovens previously used for burn-in.

REFERENCES:
patent: 4253515 (1981-03-01), Swiatosz
patent: 4553020 (1985-11-01), Val
patent: 4567432 (1986-01-01), Buol et al.
patent: 4881591 (1989-11-01), Rignall
patent: 4982153 (1991-01-01), Collins et al.
patent: 5014904 (1991-05-01), Morton

Affiliated with

Also associated with

Rating

Method and apparatus to heat the surface of a semiconductor die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus to heat the surface of a semiconductor die , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus to heat the surface of a semiconductor die will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-924516