Techniques for measuring the thickness of a film formed on a sub

Details Techniques for measuring the thickness of a film formed on a sub Techniques for measuring the thickness of a film formed on a sub

1991-04-29

1992-11-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 8, 437173, 374 7, 374120, 374121, H01L 2100

Patent

active

051660806

ABSTRACT:
The thickness of a thin film on a substrate surface is determined by measuring its emissivity and temperature with a non-contact optical technique and then calculating the film thickness from these measurements. The thickness of the film can be determined by this technique in situ, while it is being formed and substantially in real time, thus allowing the measurement to control the film forming process. This has application to controlling the formation of dielectric and other material layers on a semiconductor substrate in the course of manufacturing electornic integrate circuits, including automatically terminating the process at its endpoint when the layer has reached a desired thickness.

REFERENCES:
patent: 4745291 (1988-05-01), Niiya
patent: 4750139 (1988-06-01), Dils
patent: 4989970 (1991-02-01), Campbell et al.
patent: 5048960 (1991-09-01), Hayashi et al.
Pettibone et al., "The Effect of Thin Dielectric Films on the Accuracy of Pyrometric Temperature Measurement", Materials Research Society Symposia Proceedings, vol. 52, pp. 209-216, 1986.
Accufiber, "New Ways to Improve RPT Through Optical Fiber Thermometry", Application Note, 16 pages, Jul. 28, 1989.

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