Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-01-24
1988-01-12
Bashore, S. Leon
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156656, 427 98, 427306, 430314, 134 2, 134 26, 134 29, H05K 318, H05K 322, B05D 304
Patent
active
047189720
ABSTRACT:
A method of making a printed circuit board is disclosed wherein metallic seed particles are applied to a surface of the substrate. An image of the desired conductor pattern is defined by a maskant layer to permit the subsequent electroless deposition of the conductor material upon the exposed seeded areas of the substrate. Then, the substrate surface is subjected to a plasma discharge to facilitate removal of the seed particles.
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Babu Suryadevara V.
Herrmann William F.
Hoffarth Joseph G.
Markovich Voya
Wiley Robert T.
Anderson Andrew J.
Bashore S. Leon
International Business Machines - Corporation
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