Semiconductor device having a particular chip pad structure

Details Semiconductor device having a particular chip pad structure Semiconductor device having a particular chip pad structure

1991-02-01

1992-10-27

Hille, Rolf

357 68, H01L 2312, H01L 2314

Patent

active

051594340

ABSTRACT:
An encapsulated semiconductor device has a chip, a chip pad having through holes and also conducting patterns corresponding to an electrode pad of the chip, and leads. An arbitrary external terminal arrangement is obtained by combining a wire bonding operation between the conduting pattern and lead. Wire bonding is advantageously performed between the leads and electrode pads of the semiconductor chip arranged at arbitrary positions. The degree of freedom in designing areas of the chips and also a printed circuit board is improved so that a high packaging density is achieved and furthermore the printed circuit board is made compact.

REFERENCES:
patent: 4827328 (1989-05-01), Ozawa et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4910584 (1990-03-01), Mizuo
patent: 4922324 (1990-05-01), Sudo
patent: 4941033 (1990-07-01), Kishida
Nikkei Electronics, Mar. 1, 1982, pp. 120-124.

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