Use of nitrides for flip-chip encapsulation

Details Use of nitrides for flip-chip encapsulation Use of nitrides for flip-chip encapsulation

1996-09-20

1999-09-21

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438614, 438125, 257738, 257778, 257777, 257780, 257786, 22818022, 361767, H01L 2144, H01L 2348, B23K 3102, H05K 710

Patent

active

059566051

ABSTRACT:
A hermetically sealed semiconductor flip chip and its method of manufacture. The semiconductor flip chip of the present invention is sealed with a silicon nitride layer on an active surface of the flip chip. The silicon nitride layer covers the chip active surface, including bond pads and conductive connectors such as solder balls formed over the bond pads to effect electrical and mechanical connection to terminal pads of a carrier substrate. A portion of the silicon nitride layer is penetrated or removed to expose a portion of each conductive connector. The flip chip is then attached to a substrate by contact of the exposed portions of the conductive connectors with the terminal pads of the substrate. Also included in the invention is the alternative of sealing the flip chip, substrate and intervening connectors with a silicon ride layer after the attachment of the flip chip to the substrate.

REFERENCES:
patent: 3716907 (1973-02-01), Anderson
patent: 3767397 (1973-10-01), Akiyama
patent: 3978578 (1976-09-01), Murphy
patent: 5046161 (1991-09-01), Takada
patent: 5084752 (1992-01-01), Satoh et al.
patent: 5136364 (1992-08-01), Byrne
patent: 5217597 (1993-06-01), Moore et al.
patent: 5406122 (1995-04-01), Wong et al.
patent: 5481135 (1996-01-01), Chandra et al.
patent: 5547906 (1996-08-01), Badehi
patent: 5599749 (1997-02-01), Hattori
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5641113 (1997-06-01), Somaki et al.
patent: 5726501 (1998-03-01), Matsubara
Gates, L.E., "Sealed Chip-on-Board", Electronic Packaging & Production, pp. 48-50, Sep. 1994.

Affiliated with

Also associated with

Rating

Use of nitrides for flip-chip encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of nitrides for flip-chip encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of nitrides for flip-chip encapsulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-90945