Semiconductor substrate exposure method

Details Semiconductor substrate exposure method Semiconductor substrate exposure method

1996-03-29

1999-07-06

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430394, 430396, G03F 720

Patent

active

059196050

ABSTRACT:
An exposure method that enables removal of the untransferred region of a resist film without decreasing throughput of the exposure system or increasing fabrication cost of a semiconductor device. After preparing a reticle with a set of geometrically-shaped patterns, an image formation region of a resist film is exposed using the set of patterns on the reticle; thereby transferring the set of patterns to the image formation region. Then, an untransferred region of the resist film is exposed using the same set of patterns on the reticle under a different exposure condition from that in the step of transferring the set of patterns. The exposure condition is such that the set of patterns on the reticle is not transferred to the untransferred region. Preferably, the resist film is a positive resist film.

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