Apparatus for fabricating semiconductor device and method for fa

Details Apparatus for fabricating semiconductor device and method for fa Apparatus for fabricating semiconductor device and method for fa

1997-11-17

1999-07-06

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Methods

Delaminating, per se; i.e., separating at bonding face

438723, 438727, 134 11, 134 12, 134 13, B65C 326

Patent

active

059193360

ABSTRACT:
A method for treating the surface of a semiconductor layer includes the step of removing an oxide from the surface of a semiconductor layer by adding fluorine or fluoride to hydrogen radicals separately from plasma atmosphere and thereafter exposing the semiconductor layer to the mixed gas and hydrogen-terminating the surface.

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