Packaging structure of small-sized computer

Details Packaging structure of small-sized computer Packaging structure of small-sized computer

1992-05-20

1994-05-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 361725, 361736, H05K 720

Patent

active

053133625

ABSTRACT:
In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40.degree. C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50.degree. to 60.degree. C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

REFERENCES:
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patent: 4744005 (1988-05-01), Milani
patent: 4980848 (1990-12-01), Griffin et al.
patent: 4997032 (1991-03-01), Danielson et al.
patent: 5086509 (1992-02-01), Inubushi et al.
patent: 5136465 (1992-08-01), Benck et al.
IBM Tech Discl Bull vol. 20, No. 6, Nov. 1977, pp. 2428 "Cooling Electrical Equipment", Gaunt et al.

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