Process for etching an aluminum-copper alloy

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156656, 1566591, 156665, 204192E, 252 791, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

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044682840

ABSTRACT:
Plasma etching process for etching aluminum-copper alloys. The aluminum is reacted with a reactive chlorine specie, and the copper is oxidized by a nitrogen compound to form a CuCl.sub.2.Al.sub.2 Cl.sub.6 complex by which the copper is readily removed.

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