Glass-sealed ceramic package type semiconductor device

Details Glass-sealed ceramic package type semiconductor device Glass-sealed ceramic package type semiconductor device

1983-12-20

1985-11-19

James, Andrew J.

357 80, 357 71, 357 67, H01L 2158, H01L 2152, H01L 2308, H01L 2354

Patent

active

045545731

ABSTRACT:
A semiconductor device in which a silicon pellet is mounted on a ceramic substrate by means of a glass material of low melting point. To prevent the silicon pellet from being destroyed under thermal stress, the pellet is bonded to the glass material of low melting point through interposition of an adhesion reinforcing film such as an aluminum film capable of exhibiting a good wettability and a great bonding strength.

REFERENCES:
patent: 3256465 (1966-06-01), Weissenstern et al.
patent: 3793064 (1974-02-01), Budd et al.
patent: 4376287 (1983-03-01), Sechi
patent: 4401767 (1983-03-01), Dietz et al.
"Metal Glaze Conductor"-IBM Technical Disclosure Bulletin-Stevens-vol. 12, No. 10, Mar. 1970.

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