Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1997-11-18
1999-08-03
Niebling, John F.
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438781, 438782, 438787, 438789, H01L 2131
Patent
active
059337605
ABSTRACT:
The fixed charge in a borophosphosilicate glass insulating film deposited on a semiconductor device is reduced by reacting an organic precursor such as TEOS with O.sub.3. When done at temperatures higher than approximately 480 degrees C., the carbon level in the resulting film appears to be reduced, resulting in a higher threshold voltage for field transistor devices.
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Iyer Ravi
Rhodes Howard E.
Thakur Randhir P. S.
Gurley Lynne A.
Micro)n Technology, Inc.
Niebling John F.
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