Method and apparatus for reducing fixed charge in semiconductor

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

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438781, 438782, 438787, 438789, H01L 2131

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059337605

ABSTRACT:
The fixed charge in a borophosphosilicate glass insulating film deposited on a semiconductor device is reduced by reacting an organic precursor such as TEOS with O.sub.3. When done at temperatures higher than approximately 480 degrees C., the carbon level in the resulting film appears to be reduced, resulting in a higher threshold voltage for field transistor devices.

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H. Wallace Fry, et al., "Applications of APCVD TEOS/03 thin films in ULSI IC fabrication", Solid State Technology, 37, No. 3, pp. 31-40, (Mar. 1994).
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