Low profile semiconductor package

Details Low profile semiconductor package Low profile semiconductor package

1987-02-13

1989-07-04

James, Andrew J.

357 72, 357 75, 357 80, H01L 2302, H01L 2328, H01L 2316, H01L 3902

Patent

active

048455458

ABSTRACT:
A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board.

REFERENCES:
patent: 3654527 (1987-11-01), McCann
patent: 4272644 (1981-06-01), Visser et al.
patent: 4314271 (1982-02-01), Heyke et al.
patent: 4675718 (1987-06-01), Tsubokura et al.
Perrin, Electron and Appl. Ind. (France) No. 235 (15 Apr. 1977) pp. 15-17.
Matoba et al., Mitsubishi Denki Giho, vol. 53, No. 9, pp. 663-667, (Sep. 1979).

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