Inventor
active
Four-leaded dual in-line package module for semiconductor device
Lead frame structure
Low profile semiconductor package
Molding process for semiconductor devices and lead frame structu
No associations
LandOfFree
Dennis Meddles does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Dennis Meddles, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dennis Meddles will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-1050354