Semiconductor circuit interconnections and methods of making suc

Details Semiconductor circuit interconnections and methods of making suc Semiconductor circuit interconnections and methods of making suc

1997-07-03

1999-08-03

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257750, 257773, 438622, 438637, 438638, 438675, H01L 2352

Patent

active

059329289

ABSTRACT:
Interconnections to a semiconductor structure are formed by alternating ribs and contact lines which are substantially orthogonal to each other and separated from one another in two dimensions. Each contact line is connected to conductive contacts which extend through an insulation layer. The ribs, conductive contacts and contact lines are produced from a conductive layer formed over the insulation layer after the insulation layer has been masked and etched. The ribs are isolated from the contact lines and connected conductive contacts by etching the ribs to a depth below the surface of the insulation layer upon which the contact lines are located. The ribs and conductive contacts can be formed over conductive plugs which are preformed through an insulation layer formed over the semiconductor structure. The ribs, conductive contacts and conductive plugs can also be formed together. A mask is formed between bottom and top insulating layers to locate the conductive plugs. The top insulation layer is masked and etched to form the trenches and contact openings with openings through the bottom insulation layer being etched through the mask which prevents the bottom insulation layer from being etched other than to form openings for the conductive plugs. A layer of conductive material is then formed to fill the conducive plug openings, corresponding openings in the mask, the trenches and contact openings.

REFERENCES:
patent: 4789648 (1988-12-01), Chow et al.
patent: 5200807 (1993-04-01), Eguchi
patent: 5341026 (1994-08-01), Harada et al.
patent: 5380679 (1995-01-01), Kano
patent: 5466639 (1995-11-01), Ireland
patent: 5471091 (1995-11-01), Pasch et al.
patent: 5471093 (1995-11-01), Cheung
patent: 5602423 (1997-02-01), Jain
patent: 5612254 (1997-03-01), Mu et al.
patent: 5691574 (1997-11-01), Suzuki

Affiliated with

Also associated with

Rating

Semiconductor circuit interconnections and methods of making suc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor circuit interconnections and methods of making suc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor circuit interconnections and methods of making suc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-852127