Method of fabricating a contact device

Details Method of fabricating a contact device Method of fabricating a contact device

1989-10-20

1990-10-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156643, 156644, 156652, 156656, 1566591, 156668, 204 15, 324158P, 437183, B44C 122, C03C 1500, C23F 100

Patent

active

049632256

ABSTRACT:
A contact element is formed on a sheet of dielectric material by depositing conductive material in an opening in a first layer of dielectric material, and depositing a second layer of dielectric material over the first layer and over the conductive material in the opening. Material of the first layer is removed from the surface farther from the second layer so that the conductive material projects beyond the first layer.

REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
patent: 4585991 (1986-04-01), Reid et al.
patent: 4676864 (1987-06-01), Maeda et al.
patent: 4740700 (1988-04-01), Shaham et al.
patent: 4878990 (1989-11-01), Dugan et al.

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