Method of treating wafer surface

Details Method of treating wafer surface Method of treating wafer surface

1990-05-03

1992-01-07

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 156643, 156646, 134 1, 134 3, 134 31, 134 33, C03C 1500

Patent

active

050788329

ABSTRACT:
A method for treating a main surface of a wafer on which a thin film having micro openings is formed with a treatment agent includes the steps of: making the thin film hydrophilic, supplying water to the surface of the thin film, and supplying the treatment agent in vapor phase to the thin film while spinning the wafer. The rendered hydrophilic thin film causes the water supplied to the surface of the thin film to form a water film having a uniform thickness on the inner surface of the openings as well as on the surface of the thin film. A vapor phase treatment agent supplied dissolves in the water film so as to treat the main surface of the wafer at the bottom of the openings. Even if the wafer is spun at high speed, the treatment agent permeates through the water film into the openings so as to uniformly and efficiently treat the main surface of the wafer.

REFERENCES:
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4765866 (1988-08-01), Whitwell et al.
patent: 4778532 (1988-10-01), McConnell et al.
patent: 4816098 (1989-03-01), Davis et al.
patent: 4857142 (1989-08-01), Syverson
patent: 4904338 (1990-02-01), Kozicki
patent: 4931103 (1990-06-01), Atwater

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