Method for the production of semiconductor devices

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156664, 427 38, 427431, 427 35, 427 531, 2041293, 20411235, 20419237, 31323101, 31323131, 3133601, 3133631, 31511181, 31511191, 2504923, B44C 122

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048426792

ABSTRACT:
A method for the production of semiconductor devices comprising introducing source gases, etching gases or source molecules into a substrate to grow crystalline layers on said substrate or to etch said substrate, resulting in a semiconductor device, wherein said method further comprises applying a given electric potential to said substrate; applying an electric potential that is different from that of said substrate to an electron-beam irradiator disposed directly above said substrate; and irradiating said irradiator with electron beams from an electron-beam emitting means, whereby said substrate is irradiated with the secondary electron beams generated from said irradiator and/or with the electron beams transmitted through said irradiator.

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German Patent Office, Office Action (8/88) with Translation.

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