Method of depositing tungsten on silicon in a non-self-limiting

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257754, 257757, 257773, 257900, H01L 2906

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active

052124002

ABSTRACT:
A method of depositing tungsten on a substrate utilizing silicon reduction wherein the process is non-limiting as to the thickness of silicon that may be converted to tungsten. A silicon substrate is provided with at least one area of silicon material having a predetermined thickness and the substrate is exposed to a tungsten hexafluoride gas flow in a chemical vapor deposition environment. By adjusting the WF.sub.6 gas flow rate and the CVD process parameters, such as pressure, temperature and deposition time, the thickness of silicon converted to tungsten can be adjusted in order to convert the entire thickness. A novel structure having a midgap tungsten gate and tungsten source and drain metallized layers is also disclosed.

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