Method of making transducer chips with grooves on the wafer for

Details Method of making transducer chips with grooves on the wafer for Method of making transducer chips with grooves on the wafer for

1996-05-03

1997-12-02

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 1566621, 437226, 148DIG28, H01L 2100

Patent

active

056931816

ABSTRACT:
A wafer and a method of making a wafer containing a plurality of severable transducer chips includes a wafer; a plurality of transducer chips formed on the wafer; and a grid of longitudinal and latitudinal grooves in the wafer for separating the chips from each other and enabling them to be easily, individually severed from the wafer, as well as a transducer chip and a method of making it, having integral raised contacts adapted for a flip chip or beam lead interconnection, with a transducer formed on the chip; and a plurality of raised contacts integrally formed with the chip and electrically interconnected with the transducer.

REFERENCES:
patent: 4904617 (1990-02-01), Muschke
patent: 4961821 (1990-10-01), Drake et al.
patent: 5196378 (1993-03-01), Bena et al.
patent: 5385635 (1995-01-01), O'Neill
patent: 5418190 (1995-05-01), Cholewa et al.
Wolf, "Silicon Processing for the VLSI Era vol. 1-Process Technology", pp. 531-532, (1986).

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