Plastic sealed type semiconductor apparatus

Details Plastic sealed type semiconductor apparatus Plastic sealed type semiconductor apparatus

1992-05-22

1994-03-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 257686, 361730, H05K 700, H01L 2328

Patent

active

052990923

ABSTRACT:
A plastic sealed type semiconductor apparatus includes at least two semiconductor devices which are disposed with a space therebetween in such a manner that circuit forming surfaces oppose each other, and an electric signal lead which is adhered to each of the circuit forming surfaces with an insulating member provided therebetween for electric insulation and which is electrically connected to the semiconductor device by a thin metal wire. The semiconductor devices and the electric signal leads are sealed with a resin in a state where the electric signal leads are laid on top of one another to form a plastic package. The overlaid portion of the electric signal leads has a surface contact portion of the leads and a resin providing portion. The resin providing portion is a recessed portion which is formed when the resin is molded in such a manner that it passes through the surface contact portion of the leads in the lateral direction thereof. The resin providing portion prevents entry of water or moisture and thus eliminates corrosion or breakage of the electric interconnections formed on the circuit forming surface of the semiconductor device or thin metal wires. Thus, the reliability of the semiconductor apparatus is improved.

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