Method for manufacturing a thin film transistor

Fishing – trapping – and vermin destroying

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437 71, 437239, 437913, 148DIG1, 148DIG117, 148DIG150, H01L 21265

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053267125

ABSTRACT:
A method for manufacturing a semiconductor device which utilizes anodic oxidation. A first semiconductor layer of a first conductive type is formed on an insulating substrate, a highly doped second semiconductor layer of the first conductive type is formed on the first semiconductor layer, and then an anti-oxidizing pattern is formed on the second semiconductor layer to expose a predetermined portion of the second semiconductor layer. After forming the anti-oxidizing pattern, anodic oxidation is performed to oxidize the exposed portion of the second semiconductor layer. Instead of employing a conventional plasma etching process for removing the portion of the ohmic contact layer which is not in contact with the source and drain electrodes, the portion of the ohmic contact layer to be removed is subjected to anodic oxidation, to thereby form an anodic oxidation layer, thus facilitating removal of the unnecessary portions of the ohmic contact layer without the use of a plasma etching step. Accordingly, the problems resulting from the use of a plasma etching process can be avoided, so that a TFT having a high reliability can be obtained.

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Cook; "Anodizing Silicon is economical to isolate IC elements", pp. 109-113, Electronics, 1975.
Vuillermoz et al., "High Frequency Anodization of Silicon"; Insulating Films on Semi., pp. 234-237, 1983.

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