Method for enhancing aluminum nitride

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419218, 20419216, 20419222, 20419225, 437247, 148DIG3, C23C 1434, H01L 21324

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active

055207855

ABSTRACT:
A method for enhancing aluminum nitride includes, in one version, annealing sputtered aluminum nitride in a reducing atmosphere (11), and subsequently annealing the sputtered aluminum nitride in an inert atmosphere (12). A superior aluminum nitride thin film (13) results. The films can withstand exposure to boiling water for times up to twenty minutes and maintain a refractive index, N.sub.f, greater than 2.0, and a preferred crystalline orientation ratio, I(002)/I(102), in excess of 1000.

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Li Xinjiao et al., Thin Solid Films, "On the properties of AlN thin films grown by low temperature reactive r.f. sputtering", Jun. 2, 1986, vol. 139, pp. 261-274 (p. 268, last paragraph--p. 270, paragraph 1; FIG. 11).
Hantzpergue et al., Thin Solid Films, "Electrical properties of sputtered AlN films and interface analysis by Auger electron spectroscopy", 1981, vol. 75, pp. 167-176 (p. 168, paragraph 1; table 1).
Stanley Wolf and Richard N. Tauber, Lattice Press, Silicon Processing for the VLSI Era, vol. 1: Process Technology, Appendix 3, "Arrhenius Behavior", pp. 649-650.

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