Patent
1990-08-31
1992-08-04
James, Andrew J.
357 70, H01L 2312, H01L 2332
Patent
active
051363674
ABSTRACT:
A semiconductor device and package includes a tape mounted semiconductor chip using bumped contacts, the top side of the chip is covered with a thin layer of ultra violet transmissive material, and a plastic removable frame surrounds the device and is removed after testing the device and prior to mounting the device on a printed circuit board.
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Barndt B. Peter
Clark S. V.
Donaldson Richard L.
James Andrew J.
Texas Instruments Incorporated
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