Semiconductor device with bump electrode

Details Semiconductor device with bump electrode Semiconductor device with bump electrode

1990-11-26

1992-08-04

Larkins, William D.

357 65, 357 68, H01L 2348, H01L 2940, H01L 2944

Patent

active

051363631

ABSTRACT:
A semiconductor device having a bump electrode on a semiconductor substrate above an electrode pad and metal film. The shape of the bump electrode is composed of a cubical portion and a skirt extending outward from the bottom of the cubical portion. In manufacturing such a semiconductor device, a dry film is used which is laminated on the metal film under a certain laminating condition and formed with an opening. A bump material is formed as a deposit on the metal film within the opening, through electrolytic plating. The deposit has the cubical portion corresponding in shape to the opening, and the skirt extending outward into a space between the dry film and the metall film, from the bottom of the cubical portion. The metal film is etched out using the deposit as a mask to make the deposit as a bump electrode of the semiconductor device.

REFERENCES:
patent: 4087314 (1978-05-01), George et al.
patent: 4258382 (1981-03-01), Harris
patent: 4316200 (1982-02-01), Ames et al.
patent: 4742023 (1988-05-01), Hasegawa
patent: 4970571 (1990-11-01), Yamakawa et al.
27th Electronic Components Conference, Arlington, 16th-18th May 1987, pp. 130-134, A. S. Rose et al., "Metallurgical Considerations for Beam Tape Assembly".

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