Method of manufacturing circuit board for mounting electronic co

Details Method of manufacturing circuit board for mounting electronic co Method of manufacturing circuit board for mounting electronic co

1990-01-02

1991-06-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 156656, 1566591, 156902, 29846, 29852, 21912169, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

050229605

ABSTRACT:
According to the present invention, a circuit board for mounting electronic components including a metal layer united with a substrate layer with a predetermined portion of the metal layer exposed is manufactured by disposing a mask between a substrate layer and a metal layer where the metal layer is to be exposed and uniting the substrate layer and the metal layer with the mask therebetween, projecting a laser beam onto the substrate layer at the periphery of the mask to cut away the substrate layer adjacent to the mask, and stripping off that part of the substrate layer which remains on the mask and the mask.

REFERENCES:
patent: 4179310 (1979-12-01), Compton et al.
patent: 4544442 (1985-10-01), Lassen
patent: 4622058 (1986-11-01), Leary-Renick et al.
patent: 4789770 (1988-12-01), Kasner et al.
patent: 4894115 (1990-01-01), Eichelberger et al.

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