Method of forming a hermetic package having a lead extending thr

Details Method of forming a hermetic package having a lead extending thr Method of forming a hermetic package having a lead extending thr

1991-09-25

1992-08-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437183, 437216, 437218, H01L 2160, H01L 21603

Patent

active

051358905

ABSTRACT:
A hermetically sealed package for a semiconductor device includes a lid through which the leads of the device extend vertically away from the chip through an aperture in the lid which is hermetically sealed by the external terminal or electrode. The package is compact, lightweight and free of magnetic materials.

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