Symmetric multi-processor-package design

Details Symmetric multi-processor-package design Symmetric multi-processor-package design

1996-09-09

1999-10-26

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 324755, 439 70, 439160, 439331, H05K 710

Patent

active

059739240

ABSTRACT:
An integrated circuit package assembly that allows an integrated circuit package to be plugged into another integrated circuit package that is mounted to a printed circuit board. The assembly includes a first integrated circuit package assembly that is mounted to the printed circuit board. The first assembly includes a first integrated circuit package that contains a plurality of holes on the top surface of the package. The mating pins of a second integrated circuit package assembly can be plugged into the holes to couple the second assembly to the first assembly. The second integrated circuit package assembly can be added without occupying additional board space on the printed circuit board.

REFERENCES:
patent: 5266912 (1993-11-01), Kledzik
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5384692 (1995-01-01), Jaff
patent: 5559445 (1996-09-01), Eaddy et al.
patent: 5602719 (1997-02-01), Kinion

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