Etching a substrate: processes – Etching of semiconductor material to produce an article...
Patent
1997-09-25
1999-09-21
Kunemund, Robert
Etching a substrate: processes
Etching of semiconductor material to produce an article...
216 24, 216 80, H01L 21268, B08B 500
Patent
active
059549742
ABSTRACT:
A laser ablation process is described for removing the polymeric buffer layer from glass optical fibers. The ablation takes place within a flow of substantially non-oxidizing gas. In preferred embodiments, the fiber cable is flushed with dry nitrogen and irradiated by a sequence of laser pulses 200-800 .mu.s in width. A currently preferred laser is a carbon-dioxide laser emitting in the infrared portion of the spectrum. The irradiating wavelength is preferably chosen to be 90% absorbed at a depth of 0.5 to 1.0 times the thickness of the buffer layer. The polymeric buffer layer can be removed without previously treating the optical fiber with a chemical softening agent, and without causing any significant reduction in the tensile strength of the fiber.
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patent: 5024968 (1991-06-01), Engelsberg
patent: 5099557 (1992-03-01), Engelsberg
patent: 5325458 (1994-06-01), Morrow et al.
patent: 5395480 (1995-03-01), Bhardwaj et al.
patent: 5531857 (1996-07-01), Engelsberg et al.
patent: 5643472 (1997-07-01), Engelsberg et al.
Broer Matthijs Meno
Steiner Gary John
Walraven Claude Eugene
Kunemund Robert
Lucent Technologies - Inc.
Umez-Eronini Lynette T.
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