Sub-ambient temperature electronic package

Details Sub-ambient temperature electronic package Sub-ambient temperature electronic package

1995-04-21

1997-06-10

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257930, 361704, 361717, 165 802, H01L 2334, H01L 2338

Patent

active

056379218

ABSTRACT:
An integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of conducting elements. A package substrate is attached to the first plate such that a chamber is formed. The second plate is disposed within the chamber apart from the package substrate. The second plate is cooled when power is supplied to the thermoelectric device. By disposing an integrated circuit chip on the second plate and evaluating the chamber, the integrated circuit chip may be cooled to a sub-ambient temperature without internal or external condensation.

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