Production method for a micromechanical component with a movable

Details Production method for a micromechanical component with a movable Production method for a micromechanical component with a movable

1997-01-08

1998-10-06

Dutton, Brian

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

7351421, 7351436, H01L 2100, G01P 1500

Patent

active

058175393

ABSTRACT:
In order to avoid sticking effects before a movable micromechanical structure is laid bare, in a production method for a micromechanical component with a movable structure, the structure is joined to a suitable mount, such as the substrate, through an auxiliary structure, and this auxiliary structure is not removed until after the movable structure is laid bare. This method is compatible with IC production processes for integrated circuits.

REFERENCES:
patent: 5314572 (1994-05-01), Core et al.
patent: 5602411 (1997-02-01), Zettler
"A Dry-Release Method Based on Polymer Columns for Microstructure Fabrication" (Mastrangelo et al.), IEEE No. 0-7803-0957, Feb. 1993, pp. 77-81.
"Electrostatically driven vacuum-encapsulated polysilicon resonators" (Legtenberg et al.), Elsevier Science S.A., 1994, pp. 57-66.

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