Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-01-12
1990-10-23
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156656, 1566611, 156902, 427 97, 204 384, B44C 122, C23F 102, C03C 1500, C03C 2506
Patent
active
049649477
ABSTRACT:
Disclosed is a method of manufacturing a double-sided wiring substrate wherein wiring patterns having a low resistivity are formed on both surfaces of a substrate. A pin hole is formed in a thin insulating film having excellent durability by a pin. A thin metal film is formed on the upper and lower surfaces of the insulating film and the inner wall of the pin hole by vacuum deposition. A thick metal film is formed on the entire thin metal film by electroplating. Thereafter, portions of the thin and the thick metal films formed on the upper and lower surfaces of the insulating film are etched while leaving a portion of them on the inner wall of the pin hole. Conductive patterns each having a layered structure of the thin and the thick metal films are thus formed on the upper and lower surfaces of the substrate.
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patent: 4870751 (1989-10-01), Antoon
Kawamura Yoshihiro
Yarita Yoshio
Casio Computer Co. Ltd.
Powell William A.
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