Thin film forming apparatus and method

Details Thin film forming apparatus and method Thin film forming apparatus and method

1997-08-15

1999-10-26

Picardat, Kevin M.

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

438458, 438459, H01L 2130, H01L 2146

Patent

active

059727802

ABSTRACT:
A thin film forming apparatus includes a specimen holder on which a substrate for thin film formation is placed, a transfer plate opposing the specimen holder, on which a sheet film having a thin film formed on a surface is placed, a thin film forming chamber comprising the specimen holder and the transfer plate, a pressure unit for moving at least one of the specimen holder and the transfer plate and pressing the specimen holder against the transfer plate for a predetermined time while the substrate and the thin film formed on the sheet film are in contact with each other, a heating unit for heating the substrate at a predetermined temperature, and an exhausting unit for vacuum-exhausting the thin film forming chamber.

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