Process for forming a lead film

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156DIG85, 156DIG103, 156DIG102, 427 38, 427 42, 427 451, 427 62, 427 99, 427250, 427252, C30B 2308

Patent

active

043942105

ABSTRACT:
There is disclosed a process for forming a lead film by a cluster ion beam deposition which includes the step of impinging ionized and non-ionized neutral clusters having 100 to 2,000 atoms of vapor of lead loosely coupled by Van der Walls force upon a substrate within a vacuum chamber which is kept at about 10.sup.-2 Torr or less thereby forming the lead film thereon.

REFERENCES:
patent: 3816173 (1974-06-01), Eldridge et al.
patent: 4091138 (1978-05-01), Takagi et al.
patent: 4098919 (1978-07-01), Morimoto et al.
patent: 4152478 (1979-05-01), Takagi
patent: 4227961 (1980-10-01), Takagi
IBM J. Res. Develop., vol. 24, No. 2, "Fabrication Process for Josephson Integrated Circuits", (Mar. 1980).

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