Continuous process for the manufacture of printed circuit boards

Details Continuous process for the manufacture of printed circuit boards Continuous process for the manufacture of printed circuit boards

1986-02-03

1987-04-21

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156322, 156324, 156330, 1565835, B44C 122, B32B 3108

Patent

active

046594256

ABSTRACT:
A continuous method for the manufacture of a circuit board wherein a coating of a solvent-free thermosetting resin is applied to the surface of a metal foil. The resin coated foil is advanced into contact with a reinforcing cloth sheet layer to form a foil/cloth assembly. The assembly is continuously conveyed between a pair of endless belts revolving in opposite directions with mutually facing surfaces, the belts being heated to the curing temperature of the resin whereby the belts are pressed against the assembly to continuously compact the assembly and cure the resin to form a composite product which can then be circuitized from a printed circuit board.

REFERENCES:
patent: 4191800 (1980-03-01), Holtzman
patent: 4284753 (1981-08-01), Hewitt
patent: 4372800 (1983-02-01), Oizumi et al.
patent: 4451317 (1984-05-01), Oizumi et al.
patent: 4557784 (1985-12-01), Vekita et al.
patent: 4579612 (1986-04-01), Held

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