Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-03-22
1987-04-21
Lacey, David L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156DIG73, 156DIG80, 156DIG88, 156DIG102, 427 531, C30B 1322
Patent
active
046594221
ABSTRACT:
A process for producing a monocrystalline layer on an insulator, particularly in a semiconductor wafer adapted for use to produce large-scale integrated circuits, comprising the steps of providing a nonmonocrystalline layer on an insulator and heating a region of the nonmonocrystalline layer by irradiating it from two heat sources while moving the heat sources relative to the nomonocrystalline layer, thereby locally melting and transforming the nonmonocrystalline layer to a monocrystalline layer.
REFERENCES:
patent: 3096158 (1963-07-01), Gaule et al.
patent: 3585088 (1968-10-01), Schwuttke et al.
patent: 3695941 (1972-10-01), Green et al.
patent: 4081313 (1978-03-01), McNeilly et al.
patent: 4120743 (1978-10-01), Baghdadi et al.
patent: 4309225 (1982-01-01), Fan et al.
patent: 4371421 (1983-02-01), Fan et al.
patent: 4410562 (1983-10-01), Nemoto et al.
patent: 4427723 (1984-01-01), Swain
patent: 4476154 (1984-10-01), Iesaka et al.
patent: 4479846 (1984-10-01), Smith et al.
Hess et al., "Laser Annealing", Industrial Research Development, Nov. 1979, pp. 141-152.
Fujitsu Limited
Lacey David L.
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