Method of selectively applying a coating to a bilevel substrate

Details Method of selectively applying a coating to a bilevel substrate Method of selectively applying a coating to a bilevel substrate

1994-02-18

1995-01-17

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

427 58, 427355, 427358, 427384, B05D 512

Patent

active

053823176

ABSTRACT:
A method of selectively applying a coating to either the upper or lower surface of a bilevel substrate. The method includes the steps of applying a layer of photoresist over the substrate and moving a doctor blade across the substrate, thereby removing the photoresist from the upper surface while leaving it on the lower surface. The photoresist is then hardened by drying and/or curing. The photoresist is then used to facilitate removal of the coating from either the upper or lower surface of the bilevel substrate.

REFERENCES:
patent: 3941901 (1976-03-01), Harsch
patent: 4271209 (1981-06-01), DePalma et al.
patent: 4732830 (1988-03-01), DiSanto et al.
patent: 4948706 (1990-08-01), Sugihara et al.
patent: 5106441 (1992-04-01), Brosig et al.
patent: 5116704 (1992-05-01), Kwon
patent: 5120623 (1992-06-01), Brosig et al.
patent: 5169737 (1992-12-01), Haws
patent: 5187601 (1993-02-01), Yamazaki et al.

Affiliated with

Also associated with

Rating

Method of selectively applying a coating to a bilevel substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of selectively applying a coating to a bilevel substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of selectively applying a coating to a bilevel substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-745285