Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-09-13
1995-01-17
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 1566591, H05K 300
Patent
active
053823150
ABSTRACT:
A method of forming an etch mask and patterning a substrate. The method includes directing a particle beam at a substrate without using a mask to deposit an etch mask on the substrate which selectively exposes predetermined portions of the substrate, the etch mask consisting of particles mechanically placed on the substrate by the particle beam, and then etching the exposed portions of the substrate through the etch mask to form channels therein. The process is well suited to fabricating high density copper/polyimide multi-chip modules.
REFERENCES:
patent: 3625758 (1971-12-01), Stahl et al.
patent: 4428796 (1984-01-01), Milgram
patent: 4566937 (1986-01-01), Pitts
patent: 4612085 (1986-09-01), Jelks et al.
patent: 4666737 (1987-05-01), Gimpelson et al.
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4800176 (1989-01-01), Kakumu et al.
patent: 4816361 (1989-03-01), Glendinning
patent: 4818725 (1989-04-01), Lichtel, Jr. et al.
patent: 4822633 (1989-04-01), Inoue
patent: 4830706 (1989-05-01), Horwath et al.
patent: 4876112 (1989-10-01), Kaito et al.
patent: 4895735 (1990-01-01), Cook
patent: 4961822 (1990-10-01), Liao et al.
patent: 4981715 (1991-01-01), Hirsch et al.
patent: 4983250 (1991-01-01), Pan
patent: 5100501 (1992-03-01), Blumenthal et al.
patent: 5104684 (1992-04-01), Tao et al.
patent: 5116463 (1992-05-01), Lin et al.
patent: 5118385 (1992-06-01), Kumar et al.
patent: 5132878 (1992-07-01), Carey
patent: 5147823 (1992-09-01), Ishibashi et al.
patent: 5156997 (1992-10-01), Kumar et al.
patent: 5173442 (1992-12-01), Carey
patent: 5196102 (1993-03-01), Kumar
patent: 5219787 (1993-06-01), Carey et al.
patent: 5244538 (1993-09-01), Kumar
patent: 5290732 (1994-03-01), Kumar et al.
C. D. Cruz et al., "Ion Cluster Emission and Deposition From Liquid Gold Ion Sources", Journal of Applied Physics, vol. 58(7), 1 Oct. 1985, pp. 2724-2730.
Dang Thi
Microelectronics and Computer Technology Corporation
Sigmond David M.
LandOfFree
Method of forming etch mask using particle beam deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming etch mask using particle beam deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming etch mask using particle beam deposition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-745256