Method of shaping a diamond body

Details Method of shaping a diamond body Method of shaping a diamond body

1993-08-31

1995-01-17

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156 60, 156625, 1566591, H01L 2100

Patent

active

053823141

ABSTRACT:
The disclosed method of shaping a diamond body, typically a polycrystalline diamond (PCD) wafer or film, involves forming a, typically patterned, layer of an "etch-retarding" material on a surface of the diamond body, followed by etching with an appropriate etchant (e.g., molten Ce). Etch-retarding materials are selected from the materials that have low (typically less than 5%) mutual solubility with the etchant at the processing temperature, and that essentially do not form an intermetallic compound with the etchant at the processing temperature. Among etch-retarding materials are Ag, Ca, Mg, Cr, Mo, W, V, Nb, Ta, Ti, Zr, Hf, B, P, and alloys thereof, as well as ceramics such as oxides, nitrides, carbides and borides, e.g., WO.sub.2, TiO.sub.2, MoC, TiC, Fe.sub.4 N, ZrN, MoN, CeB.sub.6 and Mo.sub.2 B. The etch-retarding material typically will be of appropriately chosen, non-uniform thickness, with the thickness at a given point depending on the amount of diamond material that is to be removed at that point. The disclosed method has wide applicability, e.g., for correcting thickness variations or curvature of PCD films.

REFERENCES:
"Classification of Phase Diagrams of Metal-Carbon Systems in Relation to Diamond Synthesis"; Butylenko et al.; 1977; Sint, Almazy (4), 9-13; abstract only.

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