Protective coating combination for lead frames

Details Protective coating combination for lead frames Protective coating combination for lead frames

1993-12-27

1995-07-25

Niebling, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428673, 428675, 205 50, 205181, 205182, 257666, B32B 1501, B32B 1520, C25D 700

Patent

active

054360820

ABSTRACT:
A lead frame for a semiconductor device includes a base layer which is coated by a protective coating. The protective coating includes a layer of nickel, over which is coated a layer of copper. The layer of copper is coated by a layer of silver over which is coated a layer of palladium. Protective coatings constructed in this way are bondable, solderable, oxidation resistant, corrosion resistant, free of lead (Pb), resistant to high temperatures, cost effective, and cosmetically acceptable.

REFERENCES:
patent: 3648355 (1972-03-01), Shida et al.
patent: 4141029 (1979-02-01), Dromsky
patent: 4529667 (1985-07-01), Shiga et al.
patent: 4894752 (1990-01-01), Murata et al.
Donald C. Abbott et al., Palladium as a Lead Finish for Surface Mount Integrated Circuit Packages; Texas Instruments Incorporated, Dallas, Tex., frm IEPC Proceedings, Sep. 1990.

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