Method for forming a silicon controlled rectifier

Fishing – trapping – and vermin destroying

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437 30, 437 44, H01L 21332

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active

053690419

ABSTRACT:
A semiconductor controlled rectifier is disclosed herein. In a preferred embodiment, a first n-doped region 112 is formed in a p-doped semiconductor layer 126. A first n-well region 122 is formed within the first doped region 112. This well 122 extends through the region 112 and into the layer 126. A second n-doped region 114 is also formed in the layer 126. The second region 1114 is spaced from the first region 112. A second n-well 142 is formed in the layer 126 such that it partially overlaps the second region 114. A n-doped region 144 and a p-doped region 146 are each formed in the second n-well 142 and abut one another.

REFERENCES:
patent: 4052229 (1977-10-01), Pashley
patent: 4400711 (1983-08-01), Avery
patent: 4845045 (1989-07-01), Shacham et al.
patent: 4939616 (1990-07-01), Rountree
patent: 5012317 (1991-04-01), Rountree
patent: 5019888 (1991-05-01), Scott et al.
patent: 5072273 (1991-12-01), Avery
patent: 5140401 (1992-08-01), Ker et al.
patent: 5162888 (1992-11-01), Co et al.
patent: 5221635 (1993-06-01), Duvvury
Maloney, "Contact Injection: A Major Cause of ESD Failure in Integrated Circuits", Electrical Overstress/Electrostatic Discharge Symposium Proceedings, Sep. 23-25, 1986, pp. 166-172.
Lin et al., "A CMOS VLSI ESD Input Protection Device, DIFIDW", Electrical Overstress/Electrostatic Discharge Symposium Proceedings, Oct. 2-4, 1984, pp. 202-209.
Nelsen et al, "Design and Test Results for a Robust CMOS VLSI Input Protection Network", Electrical Overstress/Electrostatic Discharge Symposium Proceedings, Sep. 23-25, 1986, pp. 188-192.

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