Work planarizing method and apparatus

Abrading – Machine – Rotary tool

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B24B 500

Patent

active

060396385

ABSTRACT:
A method and apparatus for planarizing works can adjust an urging force or pressure applied to a work with ease in a short period of time, but also avoid wasteful use of rings. Wafers 100 adhered to a block 110 is made into contact with a lower surface plate 1. An annular ring 5 which encloses the wafers 100 is disposed in the peripheral portion of the block 110. The peripheral portion of the block 110 is pressed by a head 4 through an annular ring 5. Simultaneous with this, by rotating the lower surface plate 1 while pressing the central portion of the block 110 at a desired pressure by means of a center-pressing member 6 provided on the head 4, the wafers 100 are planarized. Preferably, the center-pressing member 6 includes a pressure chamber 7 formed in the central portion of the head 4, a pressing plate 8 mounted in an opening of the pressure chamber 7 for movement relative thereto so that it can project from the opening to thereby press the central portion of the block 110, and an air pump 9 for controlling the air pressure in the pressure chamber 7.

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