Process for forming copper wiring

Details Process for forming copper wiring Process for forming copper wiring

1992-05-29

1994-01-25

Dees, Carl F.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156657, 156666, B44C 122, C23F 100, H01L 2100

Patent

active

052813045

ABSTRACT:
A process for forming a copper wiring is composed of modifying a surface of a copper film to copper sulfide, forming the wiring pattern by etching to define a desired design of the wiring, reducing copper sulfide film to copper, and applying an insulation film to the surroundings of the wiring pattern of copper. Successively forming of the wiring is done by processing in a multichamber equipment having functions of the above.

REFERENCES:
patent: 4466859 (1984-08-01), Nelson
patent: 4913769 (1990-04-01), Kanda et al.

Affiliated with

Also associated with

Rating

Process for forming copper wiring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming copper wiring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming copper wiring will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-725519