Method and apparatus for patterning a metal layer

Details Method and apparatus for patterning a metal layer Method and apparatus for patterning a metal layer

1993-08-20

1995-03-14

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156646, 1566591, H01L 2100

Patent

active

053974336

ABSTRACT:
The present invention provides both method and apparatus for patterning a metal layer through a mask layer. A substrate or wafer having a metal layer covered by a mask layer is first placed into a chamber for processing. An etch plasma is then created over the substrate by applying energy into the chamber with an RF energy source while a gas flow is supplied into the chamber. The gas flow preferably includes chloroform and chlorine in a predetermined ratio of flow rates. By application of the process and the means for performing the process, optimal sidewall profiles for both dense and isolated metal lines can be achieved on a single die in a single process step. Specifically, dense metal lines are etched with vertical sidewalls and isolated metal lines are etched with sloped sidewalls.

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