Multichip integrated circuit module with crossed bonding wires

Details Multichip integrated circuit module with crossed bonding wires Multichip integrated circuit module with crossed bonding wires

1995-06-15

1997-04-29

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257676, 257790, 257723, 257725, 257690, 257666, H01L 2328, H01L 2348

Patent

active

056252358

ABSTRACT:
Multichip integrated circuit modules having crossed bonding wires are disclosed together with methods of making the same. The integrated circuit dies of the multi-chip modules are affixed to a suitable die supporting substrate. The dies are then electrically coupled to each other and/or to associated lead traces by wire bonding the dies, with at least two of the bonding wires being crossed. The integrated circuit dies, the bonding wires, and at least a portion of the lead traces are enclosed in a package. In one embodiment, the bonding wires used in the wire bonding step are precoated with an insulating material. In another embodiment, the insulating layers are formed on the bonding wires after the wire bonding step to prevent shorting between the wires. The insulating layers may be formed in a variety of manners. By way of example, the wires can be oxidized, or they may be coated with a protective material.

REFERENCES:
patent: 5097317 (1992-03-01), Fujimoto et al.
patent: 5325268 (1994-06-01), Nachnani et al.
patent: 5362984 (1994-11-01), Konda et al.
patent: 5373188 (1994-12-01), Michii et al.

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