Top floating-gate flash EEPROM structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257316, 257322, H01L 29788

Patent

active

056252137

ABSTRACT:
A method for forming, and a resultant structure of, a top floating gate FLASH EEPROM cell are described. There is a first insulating structure over a silicon substrate, whereby the first insulating structure is a gate oxide. A first conductive structure is formed over the first insulating structure, whereby the first conductive structure is a control gate. There is a first insulating layer over the surfaces of the first conductive structure, whereby the first insulating layer is an interpoly dielectric. There is a second conductive structure formed over the first insulating layer and over a portion of the silicon substrate adjacent to the first insulating structure, whereby the second conductive structure is a floating gate. A second insulating layer is formed between the silicon substrate and the second conductive structure, whereby the second insulating layer is a tunnel oxide. Active regions in the silicon substrate, implanted with a conductivity-imparting dopant, are formed under the second insulating layer but are horizontally a distance from the first insulating structure.

REFERENCES:
patent: 4336603 (1982-06-01), Kotecha et al.
patent: 4417264 (1983-11-01), Angle
patent: 4868629 (1989-09-01), Eitan
patent: 5293328 (1994-03-01), Amin et al.

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