Organic silicon compound, resist thermal polymerization composit

Details Organic silicon compound, resist thermal polymerization composit Organic silicon compound, resist thermal polymerization composit

1995-06-15

1997-04-29

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430170, 430192, 4302811, 4302881, 522 31, 522148, 528 40, 528 43, G03F 7004, G03F 7023, G03F 7027, G08G 7700

Patent

active

056247885

ABSTRACT:
Disclosed are an organic silicon compound having a repeating unit represented by general formula (I) shown below, a resist, a thermal polymerization composition and a photopolymerization composition containing the organic silicon compound, ##STR1## wherein R.sup.1 is a t-butyl group or a tetrahydropyranyl group, R.sup.2 is an hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 1 to 24 carbon atoms, or a substituted or unsubstituted aralkyl having 7 to 24 carbon atoms, R.sup.3 is a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 24 carbon atoms or an alkoxyl group, and k represents an integer from 0 to 4.

REFERENCES:
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patent: 5350660 (1994-09-01), Urano et al.
patent: 5352564 (1994-10-01), Takeda et al.
patent: 5372908 (1994-12-01), Hayase et al.
R.D. Miller, et al.; Polysilanes: Photochemistry and Deep UV Lithography, 1989 vol. 29, No. 13, pp. 882-886.
Robert D. Miller, et al., Polysilane High Polymers, 1989, vol. 89, No. 6, pp. 1359-1410.

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