Process for flip chip connecting a semiconductor chip

Details Process for flip chip connecting a semiconductor chip Process for flip chip connecting a semiconductor chip

1992-09-02

1994-02-08

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, 437226, 228254, 22818022, H01L 21283, H01L 2158, H01L 2160

Patent

active

052847969

ABSTRACT:
A process for a flip chip connection of a semiconductor chip includes the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and on the outside of the solder bumps, providing a cut groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.

REFERENCES:
Patent Abstracts of Japan, vol. 9, No. 8 (E-289) Jan. 12, 1985 & JP-A-59 155162 (Fujitsu KK) Sep. 4, 1984.
Patent Abstracts of Japan, vol. 16, No. 185 (E-1197) May 6, 1992 & JP-A-022130 (Sharp Corp) Jan. 27, 1992.

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